Epoxy Adhesive

BONDONE® CLEARLAM B(Ambient curing epoxy coating system)Product Description Bondone® Clearlam B is two components modified low viscous epoxy coating system. Excellent coating or lamination can be achieved on most of the substrates including glass, metals, plastics, wood, paper stickers and natural stones. When both components are mixed properly and cured at room temperature, an excellent high gloss coating can be achieved

BONDONE® POWERTITE(Ambient curing epoxy system)Product Description Bondone® Powertite is two components modified, viscous epoxy adhesive system. When resin and hardener components are mixed in recommended ratios and cured at room temperature, an excellent bond strength can be achieved with most of the substrates including glass, metals, reactive plastics, wood, textile and natural stones. Faster productivity can be achieved, if curing is performed at higher temperature between 40°C and 60°C. Curing at higher temperature is recommended to achieve optimum bond strength.Features  High bond strength High mechanical strength even in dynamic conditions  Thermally stable and suitable to perform in extreme conditions. Water and chemical resistant Applications  Artificial jewellery and jewel stone fixing  Electrical components  General engineering components Natural stones Souvenirs. Handicrafts Sports goods Thermally stable

BONDONE® CLEAR CAST(Ambient curing epoxy casting system)Product Description Bondone® Clear Cast is two components, modified, low viscosity epoxy system for clear casting and lamination application. The system is clear, having excellent optical properties with negligible shrinkage on curing. Faster productivity can be achieved, if curing is performed at higher temperature near to 40°C.

BONDONE® EPIGROUT(Ambient curing epoxy grouting system)Product DescriptionBondone® Epigrout is a two-component water cleanable

BONDONE, ABROCAST(Ambient curing epoxy system)Product Description Bondone, Abrocast Resin is un-modified epoxy resin to serve multipurpose bonding application along with Bondone, Abrocast hardener which is very low viscosity aliphatic amine.

BONDONE® BRISTLEGRIP(Ambient curing epoxy system)Product DescriptionBondone® Bristlegrip is two components modified, low viscous epoxy adhesive system. When resin and hardener components are mixed in recommended ratios and cured at room temperature, an excellent bond strength can be achieved. Faster productivity can be achieved, if curing is performed at higher temperature between 40°C and 60°C. Features Excellent resistance to solvents (xylene, MTO, etc.), water Excellent mechanical strength and electrical insulation Resistance to most chemicalsApplicationsPaint brush industries for fixing ferrule to bristles

BONDONE® EPIGROUT(Ambient curing epoxy grouting system)Product Description Bondone® Epigrout is a two-component water cleanable & stain free epoxy grout specially designed for use in floor & wall applications of ceramic tile, vitrified tile, mosaics, stone & structural glazed block.Any coloured silica powder may be used to get the desired shade of grout

BONDONE® CLEARLAM A(Ambient curing epoxy coating system)Product Description Bondone® Clearlam A is two components modified epoxy coating system. Excellent coating or lamination can be achieved on most of the substrates including glass, metals, plastics, wood, paper stickers and natural stones. If curing is done at higher temperature between 40°C and 60°C productivity must be increased. To get optimum properties of material curing can be done at higher temperature.Features  Excellent hardness  Good adhesion and flexibility  High gloss and clarity  Thermally stable and suitable to perform in extreme conditions  Good water and chemical resistant Applications  Buckles; Key-chain metal gift articles  Coating and lamination of articles  PVC, Paper stickers

BONDONE® SUPER CRYSTAL CLEAR(HSC 7361/HSC 8290)(Ambient curing epoxy coating system)Product Description Bondone®Super crystal clear is two components modified, low viscous epoxy coating system. When resin and hardener components are mixed in recommended ratios and cured at room temperature,provides high gloss and impregnation on surface of stone. Faster productivity can be achieved, if curing is performed at higher temperature between 40°C.Features  Slow reactivity leading to good resin absorbance. Superior gloss and color retention  Oven curing at <50°C which ensure energy saving Applications  Coating applications

BONDONE® CLEARTITE(Ambient curing epoxy system)Product Description Bondone® Cleartite is two components, modified, high viscosity epoxy adhesive system for clear adhesive and lamination application.It can be used with various substrates including glass, metals, wood,textile and natural stones to achieve excellent bond strength.Features  Glass like transparent  High bond and mechanical strength  Resistance to water and chemicals & thermally stable Applications  Imitation jewellery & jewel stone fixing  Glass to Glass, Glass to Paper, Glass to wood bonding  Marble joining  Textile adhesive for Zari fixing  Handicrafts and decorative arts

BONDONE® CLEAR & SPEED(Ambient curing epoxy adhesive system)Product Description Bondone® Clear & speed resin is two components modified,viscous epoxy adhesive system. When both resin and hardener components are mixed in recommended ratios and cured at room temperature, an excellent bond strength can be achieved with most of the substrates including glass, metals, reactive plastics, wood, textile and natural stones.Features  Rapid curing  Superior bond strength.Applications  Metal to Metal bonding  Metal to Non-metal bonding  Electronic component bonding

BONDONE® WOODFIX(Ambient curing filled epoxy system)Product Description Bondone® Woodfix is two components, filled epoxy adhesive system. An excellent bond strength can be achieved with most of the substrates including glass, metals, reactive plastics, wood, textile and natural stones, when cured appropriately at room temperature.Faster productivity can be achieved, if curing is performed at higher temperature between 40°C and 60°C. Curing at higher temperature is recommended to achieve optimum bond strength.Features  High bond strength  Mechanical strength even in dynamic conditions  Good electrical insulating properties Water and chemical resistant Applications  Gap filling and bonding for wood furniture industries  Bonding in wooden floor  Bonding in handicrafts  Gap filling and bonding in wooden boats & houses  Potting system for small electronics